Johann Knechtel, Ozgur Sinanoglu, Ibrahim (Abe) M. Elfadel, Jens Lienig and Cliff C. N. Sze
Three-dimensional (3D) integration of electronic chips has been advocated by both industry and academia for many years. It is acknowledged as one of the most promising approaches to meet ever-increasing demands on performance, functionality, and power consumption. Furthermore, 3D integration has been shown to be most effective and efficient once large-scale integration is targeted for. However, a multitude of challenges has thus far obstructed the mainstream transition from “classical 2D chips” to such large-scale 3D chips.